MIIT Seeks Advanced Optoelectronic Chip R&D for AI Communications

China's Ministry of Industry and Information Technology (MIIT) has unveiled a new plan to boost the development of advanced optoelectronic chips and devices. This initiative is part of a wider strategy to integrate artificial intelligence with the nation's information and communications infrastructure over the period 2026-2028.

The policy emphasizes accelerating research in areas like high-speed optoelectronic chips, all-optical switching, and co-packaged optics. It also calls for advancements in photoelectric interconnect technology for AI supercomputing and the deployment of faster backbone networks, including 400Gbps and 800Gbps systems, to enhance data transmission efficiency and reduce costs.

This policy signifies China's strategic focus on developing critical semiconductor components and network infrastructure to support the growing demands of artificial intelligence applications.