TSMC 3nm Capacity Tight, Prices to Rise 15% in Late 2026
Despite TSMC having ramped up its 3nm monthly capacity to 160,000–175,000 wafers in the second quarter, it still cannot fully meet strong customer demand and order backlogs, according to supply chain sources. Industry insiders said TSMC is planning another price increase for 3nm foundry services in the second half of 2026, with hikes of up to 15%. The Fab 18 complex in the Southern Taiwan Science Park remains TSMC’s primary production base for 3nm process technology. AI-drive
Despite efforts to increase production, TSMC's 3nm capacity remains constrained, unable to fully satisfy robust customer demand and existing order backlogs. Supply chain sources indicate that monthly capacity has reached 160,000–175,000 wafers in the second quarter. Industry analysts anticipate TSMC will implement another price hike for its 3nm foundry services in the latter half of 2026, potentially increasing costs by up to 15%. The Fab 18 complex in Taiwan is the primary manufacturing hub for this advanced process technology. The rapid growth in AI-driven demand is outpacing even aggressive capacity expansion, highlighting a significant bottleneck in the semiconductor supply chain.
This situation indicates continued high demand for advanced semiconductor manufacturing, impacting costs and availability for cutting-edge technology.
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