Chinese fab SMIC's 7nm metal pitch beats Intel 18A but lags 38% on density, teardown finds — Huawei's sanctions-beating HiSilicon Kirin 9030 is the first subject of SemiAnalysis's new teardown lab

A teardown analysis by SemiAnalysis reveals that China's SMIC has achieved a 32.5nm minimum local metal pitch on its third-generation 7nm process, rivaling Intel 18A technology. However, the analysis indicates that SMIC's 7nm process lags significantly behind in density, by approximately 38%. The Huawei HiSilicon Kirin 9030 was the first chip subjected to this new teardown lab analysis. The findings suggest progress in China's semiconductor manufacturing capabilities, particularly in achieving advanced node features. Despite improvements, challenges remain in matching leading global manufacturers in terms of overall chip density and performance. This detailed analysis provides critical insights into the state of advanced chip manufacturing.

This technical analysis provides crucial insights into the competitive landscape of semiconductor manufacturing, highlighting advancements and remaining challenges in chip technology.