Huawei seeks to match best chips without best chipmaking gear
Chinese tech giant Huawei Technologies said it had found a way to make semiconductors on a par with the best worldwide without having to use cutting-edge chipmaking equipment it is unable to access due to US sanctions. The breakthrough will allow Huawei to make high-end chips that are equivalent to 1.4 nanometres by 2031, He Tingbo, president of the company’s semiconductor business, told a tech conference in Shanghai on Monday. TSMC, the world’s biggest producer of advanced s
Huawei Technologies has reportedly developed a method to produce advanced semiconductors that can rival global leaders, despite being restricted from accessing top-tier chipmaking equipment due to U.S. sanctions. The company's semiconductor business president indicated that this innovation could enable Huawei to manufacture high-end chips equivalent to 1.4 nanometer technology by the year 2031. This development signifies a potential leap in China's domestic semiconductor manufacturing capabilities.
This development is significant as it could challenge the existing global semiconductor supply chain and reduce reliance on foreign technology for China's tech industry.
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