Huawei’s mate 90 series may launch with new Kirin chip this autumn
At the 2026 International Symposium on Circuits and Systems (ISCAS 2026) in Shanghai on Monday, He Tingbo, Huawei’s board member and head of its semiconductor business, said the company would launch a new Kirin smartphone chip this autumn that uses logic folding technology for the first time. The technology moves beyond conventional single-layer chip layouts by stacking logic structures into a dual-layer design, which can improve transistor density and energy efficiency, acco
Huawei plans to release a new Kirin smartphone chip this fall, featuring innovative "logic folding" technology. This advancement involves stacking logic structures in a dual-layer design, aiming to boost transistor density and energy efficiency. The new chip is anticipated to debut in the upcoming Mate 90 smartphone series, potentially launching in September. This move positions Huawei to compete with major players like Apple's iPhone 18 series.
This development signifies Huawei's continued efforts to overcome semiconductor restrictions and re-enter the high-end smartphone market with domestically developed advanced chip technology.
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