TSMC plans 1nm chip roadmap and up to 12 new fabs
The semiconductor race in advanced process technology is accelerating. As the first batch of 2nm chips is expected to enter production later this year, TSMC is already looking further ahead and has reportedly begun planning for 1nm process development. To prepare for future demand and long-term technology upgrades, the company is also building up to 12 new wafer fabs, which will serve as key production bases for nodes ranging from 2nm to 1.4nm. However, full commercialization
Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly charting a course for 1-nanometer (nm) chip development, even as its 2nm chips approach initial production later this year. The company is also preparing for future demand by planning the construction of up to 12 new wafer fabrication plants. These facilities are intended to support production for process nodes from 2nm down to 1.4nm.
However, the widespread adoption of 1nm technology faces considerable hurdles, including infrastructure limitations and land acquisition challenges. Delays in projects like the Longtan Phase III expansion suggest that mass production of 1nm chips may not commence until 2030 or 2031.
This development is significant as it indicates TSMC's continued leadership and aggressive investment in next-generation semiconductor manufacturing, crucial for powering future technological advancements.
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