Electrothermal co-optimization of 2.5D power distribution network with TTSV cooling
2.5D güç dağıtım ağının elektrotermik ortak optimizasyonu ile termik geçiş silikon viaları kullanılarak soğutma sistemi optimize edilmektedir.
Researchers have developed a new method for optimizing 2.5D power distribution networks. This optimization is achieved through electrothermal co-optimization, a process that integrates electrical and thermal management. The system utilizes Through-Silicon Via (TTSV) cooling technology to enhance its thermal performance. This integrated approach aims to improve the overall efficiency and reliability of power distribution in advanced electronic packages.
This advancement is important for improving the performance and longevity of complex electronic devices by managing heat more effectively.
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